OUR CIRCUITS
DOUBLELAYER

Widespread technology used in many areas of electronics.

Materials: FR4 - CEM1
Thickness of the base laminate: 0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm
Thick copper base: 18 - 35 - 70 - 105 µm
Surface Finishes: Stagno Chimico
Rame Passivato (Entek)
Hot Air Levelling Lead Free
Doratura Chimica
Doratura Elettrolitica
Nichelatura

 


 

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