OUR CIRCUITS
MULTILAYER

The rapid development of technologies for miniaturization of electronic components and the consequent decrease of the spaces, are the main causes of the multilayer printed circuit boards’ birth and development. Ci.Pi.Board realizes multilayer circuit boards able to satisfy the highest technological demands of the market.



Multilayer circuit boards up to 20 layers with standard build-up or on a customer specification for realizations with impedance control. High density multilayer circuit boards with a buried holes or blind holes technology.


Materials: FR4
Thickness of the base laminate: 0,6 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm
Thick copper base: 18 - 35 - 70 µm
Surface Finishes: Stagno Chimico
Rame Passivato (Entek)
Hot Air Levelling Lead Free
Doratura Chimica
Doratura Elettrolitica
Nichelatura

 

Ci.Pi.Board S.r.l. Via Belizzi, 47 - 29122 - Piacenza - Phone +39 0523 609530 - Fax +39 0523644875 - P.IVA: 01292290333 - Privacy policy

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